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Thiol SS Serinol Dipod (DTSPA)

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Modification : Thiol SS Dipod (DTSPA)

Catalog Reference Number
Modification Code
5 Prime
3 Prime
Molecular Weight (mw)
Extinction Coeficient (ec)
Technical Info (pdf)
Absorbance MAX
Emission MAX
Absorbance EC


Catalog NoScalePrice
26-6573-0550 nmol$287.00
26-6573-02200 nmol$287.00
26-6573-011 umol$373.10
26-6573-032 umol$430.50
26-6573-1010 umol$2,984.80
26-6573-1515 umol$3,731.00
Discounts are available for Thiol SS Dipod (DTSPA)!
Modification* Discount Price Structure
1 site/order List price
2 sites/order 10% discount
3 sites/order 20% discount
4 sites/order 30% discount
5-9 sites/order 50% discount
10+ sites/order 60% discount
*Exceptions apply

Thiol SS Serinol Dipod DTSPA) is a disulfide-containing modifier designed to functionalize synthetic DNA or RNA with multiple thiol groups and can be incorporated at any position of the oligonucleotide. Each DTPA addition leads to two thiol groups. This modifier was designed for optimal tethering of oligonucleotides to a gold surface but it can also be used for multiple reactions with maleimides and other thiol-specific derivatives.
See Gene Link Manual for Gold Surface Conjugation for details Gold Surface Thiol Conjugation

After synthesis, Gene Link supplies the oligo to the customer in the oxidized (disulfide) form. The disulfide bond can then be reduced with TCEP or dithiothreitol (DTT) to generate the fully active thiolated oligo by the customer in his/her own laboratory.

SPECIAL NOTE. Prior to use, reduce any disulfide formation using 100 mM TCEP or DTT for 30 minutes at room temperature.TCEP 0.5M solutions is available from Gene Link, Catalog Number: 40-5116-10. TCEP use is recommended for reduction as conjugation efficiency are 2-3% higher if TCEP is used.

See Gene Link thiol reduction technical sheet for details Thiol Reduction Protocol

- Thiol SS Serinol Dipod (DTSPA)

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